Neuheiten

Wir freuen uns auf Ihren Besuch zu unserem Stand 307 / Halle A2, vom 13. bis  16.11.2018 auf der Messe "Electronica 2018" in München.

Zu einem Termin, wollen Sie bitte an sales@teko.it emailen.

Ihr Team TEKO.

We are glad to see you from 12 to 14 October on the exhibition MAKER FAIRE 2018 in ROME (Italiy)

Hall 8 - Booth 8.C.09

We are happy to arrange an appointment, please send e-mail request to:  sales@teko.it

We are glad to see you from 27 February to 1 March on the exhibition "Embedded World 2018" in Nuremberg.

We are happy to arrange an appointment, please send e-mail request to  sales@teko.it

Wir freuen uns auf Ihre Besuch vom 08. bis  11.11.2016 auf der Messe Electronica 2016 in München.

Auch in diesem Jahr möchten wir Sie gerne wieder an unserem Messestand (Halle B1 Stand 354) Willkommen heißen. 

Gerne vereinbaren wir einen Termin, rufen Sie bitte an  089 427 2230

oder mailen an tech@aurelelektronik.de

Ihr Team TEKO

Four Year after the launch of the first board, the Raspberry  Foundation  celebrates the anniversary by introducing on the market the new Raspberry Pi3 Model B board.

This powerful board can be enclosed in the new professional housing of TEKO , the TEK-BERRY3.

Commonly used accessories for TEKO’s Raspberry casings are still compatible with this new case.

The new Raspberry Pi3 is equipped with a Quad Core processor  that  inevitably raises the operating temperature to over 20° . TEKO’s Cooling kit – levels off the temperature of Your Raspberry board.

LED holes are still placed in correspondence with the actual CHIP  antenna. This allows to use the same case both for Pi3 and for Pi2 by simply changing the position of the light guides supplied in the kit.

A new enclosure specific for Raspberry PI 2 and model B+ is now available at TEKO. The upgrade in height allows to easily  set up supplementary break out boards and add-on modules.

Global recognized features make of this housing the most adaptable solution currently present on the market:

• LED Status Light Pipes
• Raspberry Pi Mount with Screw
• Easy and secure snap-on closing
• Air vents on the bottom
• Pre-cut for GPIO 40 Pin Ribbon Cable
• Moulded in ABS+ PC (V0)
• Compatibile with RPI-VESA and RPI-CAM

The NEW professional case specific for housing the Raspberry Pi™ mod.B+. Moulded in flame-retardant ABS+PC. Easy snap-on closing. Brigth LED light-guide on the front. Improved air vents on the bottom. Protection cover for MicroSD card slot. TEK-CAM+ suitable to accept RPI Model B+ and TEK-CAM for RPI Model B Rev1 and Rev2. It’s specific design allows users an easy positioning of the lens to take high quality shot and recording. Three colours available (black, white and transparent). Accessories: Vesa mount adapter (RPI-VESA), heatsinks cooling KIT (RPI-COOLKIT).

Stable and functional Beaglebone Black-case featuring a square shape and a modern design that guarantees a perfect fitting of top and bottom to protect the board. Molded in Flame retardant material (ABS+PC), it is perfect for both personal and commercial projects. Three colors (black, white, transparent). Brigth LED light-guide on the front. Aeration slots on the perimeter of the base. Snap-on closing. Compatible with Vesa mount adapter (RPI-VESA).

Protective case designed specifically for Arduino Yun microcontroller board. TEK-YUN is a two-shells case molded in flame retardant ABS+PC. Thanks to the sharing template can be easily adapted to any Arduino board. It provides long-lasting protection for the Arduino Yun while giving an easy access to all Arduino connectors. Internal fixing studs for an easy and intuitive fixing of the board. Three colors available (black, white, transparent). Snap-on closing.

Reliable, robust, superior quality case in flame retardant material (ABS+PC), specifically oriented to accept embedded boards. One size, three colors (black, white, transparent). Aeration slots along the perimeter of the base, supplied with transparent rounded non-slip feet. Screws connection with 4 stainless steel screws. Easy to be customised by CNC machining according to individual hardware requirements.